Impact of via geometry and line extension on via-electromigration in nano-interconnects
Talk or Poster (with paper)
- Category: Poster contribution
- Title: Impact of Via Geometry and Line Extension on Via-Electromigration in Nano-Interconnects
- Authors:
- Saleh, Ahmed S. (m, external)
- Zahedmanesh, Houman (m, external)
- Ceric, Hajdin (m, E360)
- De Wolf, Ingrid (f, external)
- Croes, Kristof (m, external)
- Presenters:
- Saleh, Ahmed S. (m, external)
- Conference: IEEE International Reliability Physics Symposium (IRPS)
- Proceedings Title: Proceedings of the IEEE International Reliability Physics Symposium (IRPS)
- Proceedings Link: https://ieeexplore.ieee.org/xpl/conhome/10117589/proceeding
- Conference City: Monterey, CA
- Conference Country: USA
- Conference Dates: 26/03/2023 - 30/03/2023
- Conference Format: On-site
- Conference Website: https://www.irps.org/
- Start Page: P38.MB-1
- End Page: P38.MB-4
- Number of pages: 4
- ISBN: None
- DOI: 10.1109/IRPS48203.2023.10118027
- Language: English
- Keywords: electromigration, void dynamics, nanointerconnect, line extension, via taper angle
- Open access: no
- Research projects: None
- TU Wien Core facilities: None
- Research areas -- Focal Areas and Fields: Modeling and Simulation (50%), Metallic Materials (20%), Nanoelectronics (30%)
- Invited: no
- Reviewed: yes
- File attachments:
Edited by Davoudi, Mohammad Rasool