Modeling Plasma-Induced Damage During the Dry Etching of Silicon

Talk (with paper)

• Category: Poster contribution
• Title: Modeling Plasma-Induced Damage During the Dry Etching of Silicon
• Authors:
  • Reiter, Tobias (m, E360)
  • Klemenschits, Xaver (m, E360/external)
  • Filipovic, Lado (m, E360)
• Presenters:
  • Reiter, Tobias (m, E360) >
• Conference: IEEE International Integrated Reliability Workshop (IIRW)
• Proceedings Title: Proceedings of the IEEE International Workshop Integrated Reliability
• Proceedings Link: https://ieeexplore.ieee.org/xpl/conhome/10032732/proceeding
• Conference City: South Lake Tahoe, CA
• Conference Country: USA
• Conference Dates: 09/10/2022 - 14/10/2022
• Conference Format: On-site
• Conference Website: https://www.iirw.org/
• Start Page: 10032764-1
• End Page: 10032764-5
• Number of pages: 5
• ISBN: 978-1-6654-5369-1
• DOI: 10.1109/IIRW56459.2022.10032764
• Language: English
• Keywords: Plasma-induced physical damage, Dry plasma etching, Process simulation, Modeling and simulation
• Open access: no
• Research projects:
  • Austrian Research Promotion Agency (FFG): 878662, Process-Aware Structure Emulation for Device-Technology Co-Optimization
• TU Wien Core facilities: None
• Research areas, (pick from TU Wien Research Matrix.):
  • Modeing and Simulation (60%)
  • Nanoelectronics (20%)
  • Surfaces and Interfaces (20%)
• Invited: no
• Reviewed: yes
• File attachments:
  • Paper as PDF: Reiter_IIRW2022.pdf
  • Proof of review as PDF: Reiter_IIRW2022_acceptance.pdf