Physics-Informed Compact Model for SF6/O2 Plasma Etching

Talk or Poster (with paper)

• Category Full-paper Contribution
• Title: Physics-Informed Compact Model for SF6/O2 Plasma Etching
• Authors:
  • Filipovic, Lado (m, E360)
  • Bobinac, Josip (m, E360)
  • Piso, Julius (m, E360)
  • Reiter, Tobias (m, E360)
• Presenters:
  • Filipovic, Lado (m, E360) >
• Conference: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
• Proceedings Title: e.g. Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
• Proceedings Link: https://ieeexplore.ieee.org/xpl/conhome/10319472/proceeding
• Conference City: Kobe
• Conference Country: Japan
• Conference Dates: 27/09/2023 - 29/09/2023
• Conference Format: On-site
• Conference Website: https://sispad2023.jp/
• Start Page: 73
• End Page: 76
• Number of pages: 4
• ISBN: 979-8-3503-1368-0
• DOI: 10.23919/SISPAD57422.2023.10319479
• Language: English
• Keywords: Process simulation and emulation, Design-technology co-optimization (DTCO), Technology computer-aided design (TCAD), SF6/O2 etching, Compact model
• Open access: no
• Research projects:
  • ProMod
• TU Wien Core facilities: None
• Research areas -- Focal Areas and Fields:
  • Modeling and Simulation (60%), Nanoelectronics (40%)
• Invited: no
• Reviewed: no
• File attachments:
  • Paper as PDF:SISPAD2023_Filipovic_final
  • Proof of review as PDF:SISPAD2023_Filipovic_Acceptance.pdf